For PCB fabricators and OEMs
A next-generation FR-4 alternative, designed for your existing line.
Bisket is a bio-based laminate for circular electronics manufacturing. Our design goal: run on existing FR-4 lines with no new capex and no retraining. We'll show you on your own line.
For PCB fabricators
What we'll prove together in a side-by-side trial on your line.
Bisket panels and your FR-4, same design, same line. You keep the data.
- 01
Process compatibility
“Can I run this on my existing line?”
Bisket is designed to run on existing FR-4 lines, with no new capex or retraining as the goal. In the trial we check lamination, imaging and etching, drilling and routing, and tool wear against your FR-4 baseline.
- 02
Yield
“Will my yield drop?”
Same design, same line, same operators. We compare first-pass yield, scrap and rework directly with your FR-4 run, so you judge with your own numbers.
- 03
Cost
“What does it cost per board?”
We look at cost per finished board on your line: material, cycle time and any process adjustments, not just sheet price.
- 04
Supply
“Can you deliver when I need it?”
Our feedstock is Indian agricultural residue, processed with fabrication partners in Bengaluru and Chennai. We share sample availability and volume plans for your programme upfront.
How a trial works
Four steps, on your line.
- 1
Share your board
Tell us the design, stack-up and application. Single-layer, low-power boards fit best today.
- 2
Receive evaluation panels
We supply Bisket panels sized for your process, with handling guidance.
- 3
Run side by side
Build the same design on Bisket and on FR-4, on the same line.
- 4
Review together
Compare process behaviour, yield and cost per board, then decide on next steps.
Target applications
Built first for low-power electronics.
Single-layer boards are available now, a natural fit for low-power designs. Multilayer is in development; HDI, high-speed and automotive programmes are not our focus yet.
LED lighting
Driver and module boards for low-power LED products.
IoT devices
Sensor nodes, trackers and connected low-power electronics.
Wearables
Where a lighter board matters: density 1.1–1.28 g/cm³ vs ~1.9 for FR-4.
Qualification roadmap
Certifications: where we are, and what's next.
We publish status plainly. Items marked in progress or planned are not yet certified.
Achieved
UL94 V-0
Flame rating, achieved halogen-free
In progress / planned
IPC-4101
Base material specification
IPC-6012
Rigid board qualification and performance
IPC-A-600
Printed board acceptability
RoHS / REACH
Regulatory compliance for export markets
Thermal cycling (IPC-TM-650)
Long-term thermal reliability
CAF resistance
Conductive anodic filament reliability
Solder float, 260 °C
Solder heat exposure
LCA / carbon footprint
Life-cycle assessment
Resources
Whitepapers and test results, on request.
We share documents directly with engineering and procurement teams. Email founder@bisketlabs.com.
Whitepaper
The material platform, how it is made, and how it compares with FR-4.
Request by email →Reliability test results
Reports from completed tests, with updates as qualification progresses.
Request by email →Technical data for evaluation
Detailed material data and processing guidance for your engineering team.
Request by email →
Also on the balance sheet
Sustainability, as a bonus for your OEM customers.
- Made from crop residue that is otherwise often burned in the field, helping tackle stubble burning.
- Halogen-free and glass-fibre-free, designed for a controlled end-of-life.
- A domestic, India-based supply chain for PCB laminates.