Our technology
From biomass to circuit board.
Our proprietary lignocellulosic resin turns agricultural residue into a glass-free PCB laminate — about 84% organic by volume, with a controlled end-of-life.
Where we are now
Single-layer boards: available now
Working prototypes running real circuits
Multilayer: in development
Early builds, under development
~84% organic by volume
Lignocellulosic resin, no glass fibre
Technical depth
Want the full dataset? We share detailed material data privately with evaluation partners.
Measured performance
Tougher, lighter and more arc-resistant than FR-4.
- Glass transition temperature (Tg)
- 262°C
High thermal headroom for soldering and operation
- UL94 flame rating
- V-0
Achieved halogen-free
- Arc resistance
- Up to 325s
vs 120–180 s typical for FR-4 · tested at CIPET Chennai, Aug 2026
- Unnotched Izod impact strength
- 129–152kJ/m²
vs 3.7–8 kJ/m² typical for FR-4
- Density
- 1.1–1.28g/cm³
Lighter than FR-4 (~1.9 g/cm³)
- Volume resistivity
- Up to 2.4 × 10¹³Ω·cm
Strong electrical insulation
Flame-retardant and heat-stable
Halogen-free UL94 V-0, a measured Tg of 262 °C, and arc resistance up to 325 s.
Made to manufacture
Processed with PCB fabrication partners in Bengaluru and Chennai — not just in the lab.
A platform, shipping single-layer first
Single-layer boards available now for low-power electronics: LED lighting, IoT devices and wearables. Multilayer in development. Qualified application by application.
Prototypes
Boards that already work.
Qualification roadmap
Certifications: where we are, and what's next.
We publish status plainly. Items marked in progress or planned are not yet certified.
Achieved
UL94 V-0
Flame rating, achieved halogen-free
In progress / planned
IPC-4101
Base material specification
IPC-6012
Rigid board qualification and performance
IPC-A-600
Printed board acceptability
RoHS / REACH
Regulatory compliance for export markets
Thermal cycling (IPC-TM-650)
Long-term thermal reliability
CAF resistance
Conductive anodic filament reliability
Solder float, 260 °C
Solder heat exposure
LCA / carbon footprint
Life-cycle assessment
Resources
Whitepapers and test results, on request.
We share documents directly with engineering and procurement teams. Email founder@bisketlabs.com.
Whitepaper
The material platform, how it is made, and how it compares with FR-4.
Request by email →Reliability test results
Reports from completed tests, with updates as qualification progresses.
Request by email →Technical data for evaluation
Detailed material data and processing guidance for your engineering team.
Request by email →
Tell us about your board and we'll tell you honestly whether Bisket fits, today or on our multilayer roadmap.